Electronic Design Innovation Conference (EDI CON)

EDI CON USA is first industry event in the USA to bring together RF, microwave, EMC/EMI, and high-speed digital design engineers and system integrators for networking, product demonstrations, training, and learning opportunities. Got a design challenge? Bring it to EDI CON USA and ask your peers and industry experts about it. 

Learn from the best, the brightest, and those actually working on the leading edge, creating the products and enabling the technologies that make communication possible. The EDI CON USA exhibition and conference cover what you need to know: wireless, 5G, IoT, backplane, power integrity, signal integrity, modeling, measurement, radar, autonomous vehicles, sensors, interference, shielding, spectrum control, simulation, verification, and more.

Features: 5G Symposium, High-Speed Design Symposium, and new added training sessions in EDI CON University. The conference will cover RF/microwave, Signal/Power Integrity, and EMC/EMI topics in addition to an exhibition with about 100 companies. 

Special discounts codes: 
StudentsEDIStudents18 for free access
Non-students: FM30 for 30% off. 
MORE INFO and Registration: www.ediconusa.com


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